Exploring Load Pull Techniques for Next-Generation Sub-THz Components
Exploring Load Pull Techniques for Next-Generation Sub-THz Components Giampiero Esposito, Business Development Manager, Solutions Architect, Maury Microwave, Inc. As wireless and sensing technologies push into the sub-terahertz (sub-THz) spectrum (100–300 GHz), engineers face both immense opportunity and significant technical challenges. This frequency range offers unprecedented potential for high-data-rate