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印刷电路板和连接线的信号完整性分析

Webinar: Signal integrity analysis on PCB and interconnects

本网络研讨会面向从事数字设计的信号完整性工作的工程师。研讨会将通过印刷电路板和连接线重点讨论通道影响,例如阻抗失配、印刷电路板材料的损耗和频率响应、意外串扰和谐振结构。

研讨会将通过矢量网络分析仪和示波器讨论典型测量,例如回波和插入损耗、模式转换、偏移、一段时间内的阻抗、串扰和眼图测量。测量示例和演示将让理论焕发新生机,有助于确定首选的合适解决方案。

Joern Pfeifer studied Electronics Engineering at the University of Applied Sciences in Emden, Germany, and graduated with a degree in High Frequency Engineering. As an Application Engineer, he joined Rohde & Schwarz in 2016 and focuses on high speed digital design applications. He is a contributing member of the OPEN Alliance Automotive Ethernet TC9 working group.

Joern Pfeifer

Dr. Alexander Kuellmer received his master's degree in Electrical Engineering and Information Technology at University Stuttgart, Germany, in 2009 and his Doctor of Engineering degree at the Technical University of Braunschweig at the institute for EMC in 2016. Since then, he has been working as an Application Engineer for digital test solutions and joined Rohde & Schwarz in 2018.